Wafer Level Packaging Market Report 2019 Estimated Forecast to 2025 | Amkor Technology, Fujitsu, Deca Technologies, Qualcomm, Toshiba
Premium Market Insights latest report, “Wafer Level Packaging Market – Global”, provides detailed insights into the market dynamics to enable informed business decision making and growth strategy formulation based on the opportunities present in the market.
The exclusive report on Wafer Level Packaging Market research report has been formulated with the help of extensive primary research (inputs from industry experts, companies, and stakeholders) and secondary research to get a universal view of the market. The report gives an in-detailed information across global regions, including North America, Europe, Asia Pacific (APAC), Middle East & Africa (MEA), and South America & Central America (SCAM).
Wafer level packaging is a cost-effective technology with technological improvements such as lower form factor, smaller thickness, lower pitches, high density of I/O counts, lower power consumption, and higher package density, which makes it an excellent packaging technology for high end electronic gadgets. It is extensively used in portable electronic devices as it enhances the performance and durability of the device, for instance, iPhone 5 has at least 11 different WLPs, the Samsung Galaxy S3 has 6 WLPs and the HTC One X has 7. Continuous research & development activities to develop innovative and improved packaging technology, are in progress which will lead to the growth of the market.
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The key players covered in this study:
Amkor Technology Inc.
Fujitsu Ltd.
Jiangsu Changjiang Electronics Technology Co. Ltd.
Deca Technologies
Qualcomm Inc.
Toshiba Corp.
Tokyo Electron Ltd.
Applied Materials, Inc.
ASML Holding NV
Lam Research Corp.
POTENTIAL BENEFITS FOR STAKEHOLDERS:
This report provides an in-depth analysis of the world wafer level packaging market and offers current and future trends to identify lucrative investment pockets
This report identifies the key drivers, opportunities, and restraints that shape the market and provides an impact analysis for the forecast period
Porter’s Five Forces analysis highlights the potency of buyers and suppliers that participate in this market. This would further offer a competitive advantage to stakeholders to make profitable business decisions; thereby, helping them to strengthen their supplier and buyer networks
Current and future trends are outlined to determine the overall attractiveness and highlight the profitable trends to gain a stronger foothold
Market estimation of geographic segments is derived from the current scenario and expected trends
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Table of Content of Wafer Level Packaging Market Report:
- INTRODUCTION
2 KEY TAKEAWAYS
3 MARKET OVERVIEW
4 WAFER LEVEL PACKAGING MARKET, BY TYPE
5 WAFER LEVEL PACKAGING MARKET, BY END USER
6 WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY
7 COMPANY PROFILES
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