Global 3D ICs Market Research Report 2019 to 2025
MarketResearchNest.com adds “Global 3D ICs Market Professional Survey Report 2019” new report to its research database. The report spread across 106 pages with multiple tables and figures in it.
This comprehensive Global 3D ICs Market research report includes a brief on these trends that can help the businesses operating in the industry to understand the market and strategize for their business expansion accordingly. The research report analyzes the market size, industry share, growth, key segments, CAGR and key drivers.
3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
The global 3D ICs market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on 3D ICs volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D ICs market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of 3D ICs in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their 3D ICs manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
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Top manufacturers/players, sales volume, price, revenue (Million USD) and market share for each manufacturer/player:
- Xilinx
- Advanced Semiconductor Engineering (ASE)
- Samsung
- STMicroelectronics
- Taiwan Semiconductors Manufacturing (TSMC)
- Toshiba
- EV Group
- Tessera
Browse detail report with in-depth TOC at
https://www.marketresearchnest.com/Global-3D-ICs-Market-Professional-Survey-Report-2019.html
Segment by Regions
- North America
- Europe
- China
- Japan
- Southeast Asia
- India
Segment by Type
- 3D SiCs
- Monolithic 3D ICs
Segment by Application
- Automotive
- Smart Technologies
- Robotics
- Electronics
- Medical
- Industrial
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